Braze Alloys
Copper-ABA® Technical Information
High-purity Active Braze Alloy of copper, silicon, titanium and aluminium, developed for direct application to ceramic surfaces.
Key Benefits
- Wets and bonds to virtually any metallic surface, as well as to non-metallics such as oxides, nitrides and carbides
- Allows ceramic-to-ceramic and ceramic-to-metal surfaces to be brazed without metallizing, firing and electroplating
- Cuts time and costs in manufacture of ceramic/metal assemblies
- Produces strong, highly reliable and vacuum-tight brazed joints
Typical Applications
- One step bonding to ceramics
Nominal Composition by Weight
- Copper (Cu): 92.75%
- Silicon (Si): 3.0%
- Titanium (Ti): 2.25%
- Aluminium (Al): 2.0%
Suggested Base Materials
Copper, Kovar, Nickel, Carbon/ low alloy & Tool/high speed steel, Stainless steel, Ni-super alloys, Titanium, Refractory metals, Ceramics, Graphite, Diamond, Tungsten Carbide
Forms Available
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Copper-ABA® Thermal Properties |
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|---|---|---|
|
°C |
°F |
|
|
Liquidus |
1024 |
1875 |
|
Solidus |
958 |
1756 |
|
Copper-ABA® Physical Properties* |
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|---|---|---|---|---|
|
Metric |
Imperial |
|||
|
Coefficient of Thermal Expansion (CTE) |
19.5 |
x10-6/°C for 20-850°C |
10.8 |
x10-6/°F for 68-1562°F |
|
Thermal Conductivity (Calculated) |
38.0 |
W/(m*K) |
22.0 |
BTU/ft h °F |
|
Density |
8.1 |
Mg/m3 |
0.293 |
lb/in3 |
|
Yield Strength (0.2% offset) |
279 |
MPa |
40.5 |
x103 lb/in2 |
|
Tensile Strength |
520 |
MPa |
75.4 |
x103 lb/in2 |
|
Elongation (2in/50mm gage section) |
42 |
% |
||
|
Electrical Resistivity |
198 |
x10-9(ohm*m) |
||
|
Electrical Conductivity |
5.05 |
x106/(ohm*m) |
||
|
Recommended Brazing Temperatures |
1025 - 1050 |
°C |
1877 - 1922 |
°F |
|
Recommended Brazing Atmospheres |
10-5 mm Hg |
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* Please note that all values quoted are based on test pieces and may vary according to component design. These values are not guaranteed in any way and should only be treated as indicative values. They should be used for guidance only and for no other purpose whatsoever.